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1. PlasmaPurge™

• Clean and decontaminate all board surfaces
  
• Desmear landing pads at microvia bottoms
  

Viper™ Applications

2. Deposit full-build copper after patterning your lines with  permanent photoresist and forming microvias. Then planarize.

• Get superior adhesion
  
• Avoid copper bridging between close lines
  
• Avoid voids in small microvias
  

1. Deposit a seed layer over entire board before patterning

• Get superior adhesion
  
• Eliminate slow electroless plating or thin foils
  

PlasmaPlate™ Applications

Viper™ and PlasmaPlate™ Plasma Processing Applications

2. PlasmaPunch™

• Form your smallest microvias with plasma etching after patterning with liquid photoresist.
  
• Avoid problems with dissolving dry film from tiny vias.