About DeposiTech
Who We Are
Two colleagues who met while at Bell Laboratories founded DeposiTech, Inc. in 1994. Daryl Ann Doane was experienced in integrated circuit (IC) chip fabrication, and her colleague was experienced with fabrication of printed circuit boards (PCBs). Their original vision was to deposit thick copper layers onto PCBs with high adhesion to facilitate fabrication of high-density thin conductor lines. DeposiTech continues with R&D for depositing copper onto large surfaces in a vacuum environment.
Capabilities
DeposiTech develops simple metal evaporators with 12” (300 mm) extent. When a transport system carries a substrate inside a vacuum chamber, these evaporators deposit metal onto substrates as large as 12” x 18”. Plasma excitation (ionization) of the evaporated metal increases the adhesion of the metal deposited on the substrate (the PlasmaPlate™ process). While the initial focus is on depositing thick (10µm to 50µm) layers of copper for PCBs, the equipment in principle can deposit other metals onto substrates. The process only requires a 12” long rod of the metal as the source.
Our Mission
DeposiTech carries on the vision of Daryl Ann Doane to glorify our God and Savior Jesus Christ, who has carried the company through seemingly impossible challenges. In meeting industry needs with innovative solutions, we wish to emulate Johann Sebastian Bach, who signed his musical compositions “SDG” (Soli Deo Gloria).